EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION

WIPO Patent Application WO/2017/010401

A1

The present invention provides: an epoxy resin composition giving a hardened object which retains excellent dielectric properties (low permittivity and low dielectric dissipation factor) and has high strength of bonding to metals; a process for producing the epoxy resin composition; a hardened object obtained by hardening the epoxy resin composition; and uses of the epoxy resin composition. The present invention involves: an epoxy resin composition which comprises an epoxy resin represented by formula (1), a hardener based on an acid anhydride, and a hardening accelerator; a process for producing the epoxy resin composition; an object obtained by hardening the epoxy resin composition; and uses of the epoxy resin composition. (In the formula, X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring or is a divalent group represented by formula (2) (wherein Y is a linking bond, a C1-6 alkylene group, etc.); the R1 moieties are the same or different and are each a C1-18 alkyl group, etc.; the R2 moieties are the same or different and are each a C1-18 alkylene group, etc.; the R3 moieties are the same or different and are each a C1-18 alkyl group, etc.; and the two n's are the same or different and are each an integer of 0-3.)

FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
NEMOTO NOBUKATSU (JP)

PCT/JP2016/070158

January 19, 2017

July 07, 2016

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SUMITOMO SEIKA CHEMICALS (JP)

C08G59/30; C09J11/06; C09J163/00; H01L23/29; H01L23/31

JP2003519705A	2003-06-24
JP2012001668A	2012-01-05
JP2006176762A	2006-07-06
JPH10335768A	1998-12-18

See also references of EP 3321302A4

SAEGUSA & PARTNERS (JP)

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