Title:
EPOXY RESIN COMPOSITION, SEMI-CURED EPOXY RESIN COMPOSITION, RESIN SHEET AND PREPREG
Document Type and Number:
WIPO Patent Application WO/2016/121758
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition, a resin sheet which is a sheet-shaped molded body of the epoxy resin composition, a prepreg having a fiber substrate and the epoxy resin composition impregnating the fiber substrate, and a semi-cured epoxy resin composition, comprising component (A): an epoxy resin having a mesogenic skeleton, component (B): a curing agent comprising a novolac resin wherein a divalent phenolic compound has been turned into a novolac, and component (C): an inorganic filler, wherein monomeric components in the curing agent of component (B) are at most 0.6 mass% of the entire resin content in a semi-cured state (B stage).
Inventors:
KIGUCHI KAZUYA (JP)
YOSHIDA YUKA (JP)
EZURE TOMOKI (JP)
TAKEZAWA YOSHITAKA (JP)
YOSHIDA YUKA (JP)
EZURE TOMOKI (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2016/052185
Publication Date:
August 04, 2016
Filing Date:
January 26, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/22
Domestic Patent References:
WO2011135925A1 | 2011-11-03 |
Foreign References:
JP2013227451A | 2013-11-07 | |||
JP2013234313A | 2013-11-21 | |||
JP2011094005A | 2011-05-12 | |||
JP2012017405A | 2012-01-26 | |||
JP2001288247A | 2001-10-16 | |||
JP2016023227A | 2016-02-08 |
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
Patent business corporation solar international patent firm (JP)
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