Title:
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/075343
Kind Code:
A1
Abstract:
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin composition contains a polytetramethylene glycol-type epoxy resin, a heterocyclic compound that contains a nitrogen atom, and a filler; the filler is surface-treated with at least one of 3-methacryloxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane; and the content of the filler is not less than 55% by mass but less than 77% by mass relative to the total mass of this epoxy resin composition.
Inventors:
KAJIWARA MASASHI (JP)
Application Number:
PCT/JP2023/022303
Publication Date:
April 11, 2024
Filing Date:
June 15, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C08G59/22; C08K5/34; C08K9/06; H01L23/29; H01L23/31
Domestic Patent References:
| WO2018221681A1 | 2018-12-06 | |||
| WO2018221682A1 | 2018-12-06 |
Foreign References:
| JP2016027097A | 2016-02-18 | |||
| JP2018138634A | 2018-09-06 | |||
| JP2019214666A | 2019-12-19 | |||
| JP2001055488A | 2001-02-27 | |||
| JP2019077771A | 2019-05-23 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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