Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2001/005889
Kind Code:
A1
Abstract:
An epoxy resin composition for semiconductor sealing which comprises an epoxy resin, a hardener, a hardening accelerator, and a flame retardant and is excellent in flame retardancy and moldability, characterized in that the flame retardant comprises a specific boric acid compound represented by formula (1): xM(II)O.yB¿2?O¿3?.zH¿2?O (wherein 0.2$m(F)x/y$m(F)6.0; 0.2$m(F)z/y$m(F)6.0; and M(II) represents a divalent metal); and a semiconductor device with excellent reliability made using the composition.
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Inventors:
KOKAKU HIROYOSHI (JP)
NAGAI AKIRA (JP)
UENO TAKUMI (JP)
MOTEKI RYO (JP)
ISHII TOSHIAKI (JP)
SASHIMA HIROKI (JP)
NAGAI AKIRA (JP)
UENO TAKUMI (JP)
MOTEKI RYO (JP)
ISHII TOSHIAKI (JP)
SASHIMA HIROKI (JP)
Application Number:
PCT/JP1999/003817
Publication Date:
January 25, 2001
Filing Date:
July 14, 1999
Export Citation:
Assignee:
HITACHI LTD (JP)
HITACHI CHEMICAL CO LTD (JP)
KOKAKU HIROYOSHI (JP)
NAGAI AKIRA (JP)
UENO TAKUMI (JP)
MOTEKI RYO (JP)
ISHII TOSHIAKI (JP)
SASHIMA HIROKI (JP)
HITACHI CHEMICAL CO LTD (JP)
KOKAKU HIROYOSHI (JP)
NAGAI AKIRA (JP)
UENO TAKUMI (JP)
MOTEKI RYO (JP)
ISHII TOSHIAKI (JP)
SASHIMA HIROKI (JP)
International Classes:
C08K3/38; H01L23/29; (IPC1-7): C08L63/00; C08K3/22; C08K3/38; H01L23/29
Domestic Patent References:
| WO1995006085A1 | 1995-03-02 | |||
| WO1993010045A1 | 1993-05-27 |
Foreign References:
| JPH08151505A | 1996-06-11 | |||
| JPH09151301A | 1997-06-10 |
Attorney, Agent or Firm:
Takada, Yukihiko (Saiwai-cho 2-chome Hitachi-shi Ibaraki, JP)
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