Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/056668
Kind Code:
A1
Abstract:
Provided are an epoxy resin suitable for sealing a semiconductor, an epoxy resin composition containing the epoxy resin, a cured product prepared by using the epoxy resin composition, a semiconductor sealing material, and a semiconductor device containing a cured product prepared by using the semiconductor sealing material, wherein the epoxy resin of the present invention has excellent flowability and anti-blocking property, and also has excellent cured-product toughness and adhesion to metal substrates. The present invention relates to an epoxy resin, characterized in that the epoxy resin contains a glycidyl ether compound of a dihydroxy naphthalene compound (X) and has crystallinity.
Inventors:
WANG ZHIKUN (CN)
YAMOTO KAZUHISA (JP)
AOYAMA KAZUMASA (JP)
AKIMOTO GENSUKE (JP)
NAKAMURA NOBUYA (JP)
QI WEI (CN)
ZHAO WEI (CN)
LI LIYAN (CN)
YAMOTO KAZUHISA (JP)
AOYAMA KAZUMASA (JP)
AKIMOTO GENSUKE (JP)
NAKAMURA NOBUYA (JP)
QI WEI (CN)
ZHAO WEI (CN)
LI LIYAN (CN)
Application Number:
PCT/CN2020/115282
Publication Date:
March 24, 2022
Filing Date:
September 15, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
WANG ZHIKUN (CN)
WANG ZHIKUN (CN)
International Classes:
C08L63/00; C08G59/24; H01L23/29; H01L23/31
Foreign References:
| JP2010184963A | 2010-08-26 | |||
| KR20100025665A | 2010-03-10 | |||
| CN109651596A | 2019-04-19 | |||
| US5358980A | 1994-10-25 | |||
| JP2013057018A | 2013-03-28 | |||
| CN1854186A | 2006-11-01 | |||
| CN1854185A | 2006-11-01 |
Attorney, Agent or Firm:
LINDA LIU & PARTNERS (CN)
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