EPOXY RESIN COMPOSITION - TORAY INDUSTRIES

Title:

EPOXY RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/1996/020969

Kind Code:

A1

Abstract:

An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler, wherein the curing agent (B) is one containing at least two phenolic and/or naphtholic hydroxyl groups in its molecule and the inorganic filler contains silica (C) as the essential ingredient, the silica comprising 1-99 wt.% of synthetic silica and 99-1 wt.% of molten natural silica; and a semiconductor device comprising semiconductor elements sealed therewith. The composition does not cause failure in resin filling, resin peeling, resin streak, stage shift and vent clogging in the molding step. The sealed semiconductor device is excellent in moisture-resistance reliability, high-temperature reliability and soldering resistance.

More Like This:

JPH0952939	EPOXY RESIN COMPOSITION
JPH07119270	[Title of Invention] Epoxy resin
JP3235799	EPOXY RESIN COMPOSITION

Inventors:

TOKUNAGA ATSUTO (JP)
SAWAMURA YASUSHI (JP)
TANAKA MASAYUKI (JP)

Application Number:

PCT/JP1995/002742

Publication Date:

July 11, 1996

Filing Date:

December 27, 1995

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY INDUSTRIES (JP)
TOKUNAGA ATSUTO (JP)
SAWAMURA YASUSHI (JP)
TANAKA MASAYUKI (JP)

International Classes:

C08G59/24; C08G59/62; C08K3/36; C08L63/00; H01L23/29; (IPC1-7): C08G59/62; C08K3/36; C08L63/00; H01L23/29

Foreign References:

JPS6197322A	1986-05-15
JPH0463846A	1992-02-28
JPH0450222A	1992-02-19
JPH04218523A	1992-08-10
JPH04370138A	1992-12-22
JPH0329259B2	1991-04-23

Other References: