Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/131563
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition having excellent low dielectric properties. Specifically, an epoxy resin composition is provided that contains polyphenylene ether and an epoxy resin having a specific structure.
Inventors:
FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2018/000192
Publication Date:
July 19, 2018
Filing Date:
January 09, 2018
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/20; C08G59/02; C08L63/00; C08L71/12; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017010401A1 | 2017-01-19 | |||
| WO2017086368A1 | 2017-05-26 | |||
| WO2014034103A1 | 2014-03-06 |
Foreign References:
| JP2016079354A | 2016-05-16 | |||
| JP2012001668A | 2012-01-05 | |||
| US3445483A | 1969-05-20 | |||
| JP2004231728A | 2004-08-19 | |||
| GB1123960A | 1968-08-14 |
Other References:
See also references of EP 3569626A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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