Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/022148
Kind Code:
A1
Abstract:
The present invention provides: an epoxy composition configured for reduced viscosity, etc., where even when some heat is applied, progression of curing and a subsequent rise in viscosity are not promoted; an adhesive agent containing the same; and an encapsulation agent containing the same. The present invention also provides a cured product that can be obtained by curing the epoxy resin composition, the adhesive agent, or the encapsulation agent. The present invention further provides an electronic component containing the cured product.
Inventors:
SAITO ATSUSHI (JP)
Application Number:
PCT/JP2022/030949
Publication Date:
February 23, 2023
Filing Date:
August 16, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C08G59/66; C08K3/013; C08K5/3472; C08K5/3475; C09J163/00; C09K3/10; H01L23/29; H01L23/31
Foreign References:
| CN112442256A | 2021-03-05 | |||
| CN107987287A | 2018-05-04 | |||
| JP2016117851A | 2016-06-30 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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