Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/238615
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin composition which contains an epoxy resin (A) and an epoxy resin curing agent (B), wherein: the epoxy resin (A) contains an epoxy resin (A1) that has a glycidyl group derived from resorcinol, and an epoxy resin (A2) that has a glycidyl group derived from bisphenol F, or the like; the epoxy resin curing agent (B) contains resorcinol (B1) or the like; and the content of the epoxy resin curing agent (B) is 7% by mass to 60% by mass.
Inventors:
WAKAHARA DAIKI (JP)
OHNISHI NOBUYOSHI (JP)
IKEUCHI KOUSUKE (JP)
OKADA KANA (JP)
MATSUMOTO NOBUHIKO (JP)
INNAN SUSUMU (JP)
OHNISHI NOBUYOSHI (JP)
IKEUCHI KOUSUKE (JP)
OKADA KANA (JP)
MATSUMOTO NOBUHIKO (JP)
INNAN SUSUMU (JP)
Application Number:
PCT/JP2023/018273
Publication Date:
December 14, 2023
Filing Date:
May 16, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/20; C08G59/62; C08J5/24; C08K7/02; C08L63/00; C08L101/00; F17C1/06
Domestic Patent References:
| WO2017057561A1 | 2017-04-06 | |||
| WO2021200028A1 | 2021-10-07 |
Foreign References:
| JP2012533643A | 2012-12-27 | |||
| JP2020138989A | 2020-09-03 | |||
| JP2012063015A | 2012-03-29 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PRO...
Next Patent: COAXIAL CONNECTOR
Next Patent: COAXIAL CONNECTOR