Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/024881
Kind Code:
A1
Abstract:
In cases where a component having a low molecular weight is added to conventional epoxy resin compositions for the purpose of improving the workability thereof, the component having a low molecular weight is likely to volatilize and it is difficult to suppress discharge of outgas. Meanwhile, an epoxy resin composition according to the present invention is capable of suppressing the generation of outgas during a curing process even if a component having a low molecular weight is added thereto for the purpose of workability improvement; and this epoxy resin composition is able to be cured at low temperatures. An epoxy resin composition according to the present invention contains the components (A) to (D) described below; the content of epoxy resins that do not contain an aromatic ring in each molecule is 9.5% by mass or less relative to the total amount of the component (A); and the content of the component (D) is 25% by mass or less relative to the entirety of the composition. Component (A): epoxy resins
Component (B): a compound which has two or more thiol groups in each molecule
Component (C): a curing accelerator
Component (D): a filler
Inventors:
IWASAWA JYUNYA (JP)
IMAI YUSUKE (JP)
MIHASHI KOKI (JP)
IMAI YUSUKE (JP)
MIHASHI KOKI (JP)
Application Number:
PCT/JP2023/027516
Publication Date:
February 01, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08G59/20
Domestic Patent References:
| WO2021033327A1 | 2021-02-25 | |||
| WO2021033329A1 | 2021-02-25 | |||
| WO2022064972A1 | 2022-03-31 | |||
| WO2020116512A1 | 2020-06-11 | |||
| WO2015002071A1 | 2015-01-08 |
Foreign References:
| JP2016149393A | 2016-08-18 | |||
| JP2009221424A | 2009-10-01 |
Attorney, Agent or Firm:
IBC (JP)
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