Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/084968
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition comprising: (A) an epoxy resin containing two or more epoxy groups per molecule; (B) a mesogenic group-containing polyorganosiloxane represented by formula (1); and (C) an epoxy resin hardener. Thus, provided is an epoxy resin composition containing a polyorganosiloxane having a mesogenic group. [In formula (1): R1's each independently represent a group selected from an alkyl group having 1-12 carbon atoms, an aryl group having 6-12 carbon atoms and an aralkyl group having 7-12 carbon atoms, or a hydroxyl group; p represents an integer of 0-100; and R2's each independently represent a group represented by formula (2) or (3), in which R3 and R4 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1-10 carbon atoms, L represents a bivalent hydrocarbon group having 1-12 carbon atoms, a and b each independently represent an integer of 0-4, and G represents a glycidyl group.]
Inventors:
NODA DAISUKE (JP)
NAKAGAWA HIDEO (JP)
IRIFUNE SHINJI (JP)
HARADA MIYUKI (JP)
NAKAGAWA HIDEO (JP)
IRIFUNE SHINJI (JP)
HARADA MIYUKI (JP)
Application Number:
PCT/JP2023/036177
Publication Date:
April 25, 2024
Filing Date:
October 04, 2023
Export Citation:
Assignee:
SHIN ETSU CHEMICAL CO LTD (JP)
THE SCHOOL CORPORATION KANSAI UNIV (JP)
THE SCHOOL CORPORATION KANSAI UNIV (JP)
International Classes:
C08G59/18; C08K3/013; C08L63/00
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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