Title:
EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/119188
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a highly heat-resistant epoxy resin having superior thermal stability and high heat resistance; a curable resin composition; and a cured product thereof. The epoxy resin is represented by formula (1), in the entire surface area of a chart measured by means of gel permeation chromatography, triglycidyl ether bodies account for 40-75 area% and tetraglycidyl ether bodies account for 12-40 area%, the total of the triglycidyl ether bodies and tetraglycidyl ether bodies is 52-90 area%, and the tetraglycidyl ether bodies have the structure represented by formula (2). (In formula 1, the plurality of A and B present are as indicated above, and are bonded by *. Also, G indicates a glycidyl group, and m and n indicate the average number of repeats and represent a number from 0 to 5. In formula 2, G represents a glycidyl group.)
Inventors:
NAKANISHI MASATAKA (JP)
EBARA SEIJI (JP)
KIMURA MASAMITSU (JP)
EBARA SEIJI (JP)
KIMURA MASAMITSU (JP)
Application Number:
PCT/JP2015/053214
Publication Date:
August 13, 2015
Filing Date:
February 05, 2015
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/06; C07D303/30; C08G59/32; C08G59/48; C08G59/62
Foreign References:
| JPH01268714A | 1989-10-26 | |||
| JP2001278946A | 2001-10-10 | |||
| JPS4830799A | 1973-04-23 | |||
| JP2001247650A | 2001-09-11 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Download PDF: