Title:
EPOXY RESIN MODIFYING AGENT
Document Type and Number:
WIPO Patent Application WO/2019/044803
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a composition which enables the production of a cured product that is capable of achieving a good balance between heat resistance and decrease of elastic modulus, while exhibiting excellent adhesion to a copper foil. The present invention uses an active energy ray curable composition which contains an acid group-containing epoxy (meth)acrylate resin, an epoxy curing agent and a modified resin, and which is characterized in that: the modified resin has at least one specific functional group that is selected from the group consisting of a hydroxyl group and a carboxy group; the glass transition temperature of the modified resin is from -100°C to 50°C (inclusive); and the number average molecular weight of the modified resin is from 600 to 50,000 (inclusive).
Inventors:
MATSUMURA YUUSUKE (JP)
NAKAMURA AKIFUMI (JP)
NAKAMURA AKIFUMI (JP)
Application Number:
PCT/JP2018/031690
Publication Date:
March 07, 2019
Filing Date:
August 28, 2018
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/40; C08L63/00; G03F7/004; G03F7/027; G03F7/032; G03F7/035; H05K3/28
Foreign References:
| JPH11240930A | 1999-09-07 | |||
| JPH0789009A | 1995-04-04 | |||
| JPH0275618A | 1990-03-15 | |||
| JPH06228413A | 1994-08-16 | |||
| JP2010249886A | 2010-11-04 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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