Title:
EPOXY RESIN, PRODUCTION METHOD, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/225411
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an epoxy resin which provides excellent balance between the molding shrinkage rate during thermal curing of a composition containing the epoxy resin and heat resistance of a cured product thereof; a composition; and a cured product of the composition. Specifically, provided are: an epoxy resin which is a tetramethyl biphenol-type epoxy resin represented by structural formula (in the formula, n represents the number of repeats and is an integer of 0-5), and is characterized in that the content rate of 1,2-glycols in the resin is 0.065-0.10 meq/g; a production method for the epoxy resin; an epoxy resin composition containing the epoxy resin; a cured product of the epoxy resin composition; and use thereof.
Inventors:
HIROTA YOUSUKE (JP)
NAKAMURA NOBUYA (JP)
AKIMOTO GENSUKE (JP)
NAKAMURA NOBUYA (JP)
AKIMOTO GENSUKE (JP)
Application Number:
PCT/JP2018/016549
Publication Date:
December 13, 2018
Filing Date:
April 24, 2018
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/24; B29C70/02; B32B15/08; B32B15/092; C07D301/28; C07D303/28; H01L23/14; H01L23/29; H01L23/31
Foreign References:
| JPH11181047A | 1999-07-06 | |||
| JP2016108562A | 2016-06-20 | |||
| JP2013107981A | 2013-06-06 | |||
| JP2006291094A | 2006-10-26 | |||
| JPH04234867A | 1992-08-24 | |||
| JP2004307686A | 2004-11-04 | |||
| JPS62290717A | 1987-12-17 | |||
| JP2011037917A | 2011-02-24 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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