Title:
EPOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2023/100722
Kind Code:
A1
Abstract:
Provided is an epoxy resin from which a cured product exhibiting excellent dielectric characteristics and also having favorable mechanical characteristics is obtained. The epoxy resin is characterized by having a structure represented by general formula (1) and an epoxy group equivalent in the range of 300-1,000 g/eq. (In the formula, each G independently represents a glycidyl group that may have a substituent, each XA independently represents a divalent organic group containing at least one aromatic ring, each XB independently represents a divalent aliphatic group, and n represents an average number of repetitions and is a number satisfying 0
Inventors:
OGURA ICHIRO (JP)
SATO NAOYA (JP)
SATO NAOYA (JP)
Application Number:
PCT/JP2022/043217
Publication Date:
June 08, 2023
Filing Date:
November 22, 2022
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08G59/24; B32B27/38; C07D303/30; C08J5/24; C08K3/013; C08L63/00; H05K1/03
Foreign References:
| JP2019052278A | 2019-04-04 | |||
| JP2008222908A | 2008-09-25 | |||
| JP2008031344A | 2008-02-14 | |||
| JP2009203427A | 2009-09-10 | |||
| JP2009209318A | 2009-09-17 | |||
| JP2001329044A | 2001-11-27 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: