Title:
ETCH-RESISTANT COATING ON SENSOR WAFERS FOR IN-SITU MEASUREMENT
Document Type and Number:
WIPO Patent Application WO/2012/047428
Kind Code:
A3
Abstract:
A sensor wafer may be configured for in-situ measurements of parameters during an etch process. The sensor wafer may include a substrate, a cover, and one or more components positioned between the substrate and the cover. An etch-resistant coating is formed on one or more surfaces of the cover and/or substrate. The coating is configured to resist etch processes that etch the cover and/or substrate for a longer period than standard thin film materials of the same or greater thickness than the protective coating.
Inventors:
NGUYEN ANDREW (US)
QULI FARHAT (US)
SUN MEI (US)
VENKATESAN VASUDEV (US)
QULI FARHAT (US)
SUN MEI (US)
VENKATESAN VASUDEV (US)
Application Number:
PCT/US2011/050272
Publication Date:
July 19, 2012
Filing Date:
September 01, 2011
Export Citation:
Assignee:
KLA TENCOR CORP (US)
NGUYEN ANDREW (US)
QULI FARHAT (US)
SUN MEI (US)
VENKATESAN VASUDEV (US)
NGUYEN ANDREW (US)
QULI FARHAT (US)
SUN MEI (US)
VENKATESAN VASUDEV (US)
International Classes:
H01L21/66
Foreign References:
| US20040225462A1 | 2004-11-11 | |||
| US20050213079A1 | 2005-09-29 | |||
| US6776873B1 | 2004-08-17 | |||
| US20090294880A1 | 2009-12-03 |
Attorney, Agent or Firm:
MCANDREWS, Kevin (Legal DepartmentOne Technology Driv, Milpitas California, US)
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