Title:
ETCHING LIQUID COMPOSITION AND ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/080178
Kind Code:
A1
Abstract:
Provided are: an etching liquid composition for a silver-containing material, whereby a silver-containing material can be etched at a higher rate, and a fine wire can be formed having minimal tapering width in a middle part thereof; and an etching method that uses said etching liquid composition. An etching liquid composition used to etch a silver-containing material, and an etching method having a step for etching a silver-containing material using said etching liquid composition. The etching liquid composition contains (A) 0.1-30% by mass of hydrogen peroxide, (B) 0.05-60% by mass of an organic carboxylate, and water, and has a pH of 2.5 or higher.
Inventors:
SAIO YOSHIHIDE (JP)
OMIYA DAISUKE (JP)
AOKI TAMAMI (JP)
OMIYA DAISUKE (JP)
AOKI TAMAMI (JP)
Application Number:
PCT/JP2019/039614
Publication Date:
April 23, 2020
Filing Date:
October 08, 2019
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C23F1/30; H05K3/06
Foreign References:
| JPS6428385A | 1989-01-30 | |||
| JPS488704B1 | 1973-03-16 | |||
| JP2004172427A | 2004-06-17 | |||
| JPS5278632A | 1977-07-02 | |||
| JPS55164075A | 1980-12-20 | |||
| JP2012193427A | 2012-10-11 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
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