Title:
EVALUATION DEVICE, EVALUATION METHOD, AND COMPUTER PROGRAM
Document Type and Number:
WIPO Patent Application WO/2024/024631
Kind Code:
A1
Abstract:
Provided are an evaluation device, an evaluation method, and a computer program. The present invention comprises: an acquisition unit that acquires data related to a surface temperature distribution of a component to be assembled onto a substrate processing device; and an evaluation unit that evaluates the assembly accuracy of the component on the basis of the acquired data related to the surface temperature distribution of the component.
Inventors:
MORIYA TSUYOSHI (JP)
NAGAIKE HIROSHI (JP)
NAGAIKE HIROSHI (JP)
Application Number:
PCT/JP2023/026605
Publication Date:
February 01, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/31
Foreign References:
| JP2021044288A | 2021-03-18 | |||
| JP2022519348A | 2022-03-23 | |||
| JP2011054933A | 2011-03-17 | |||
| JP2006140237A | 2006-06-01 | |||
| JP2020064909A | 2020-04-23 | |||
| JP2007059585A | 2007-03-08 |
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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