Title:
EXPANDABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/060986
Kind Code:
A1
Abstract:
An expandable resin composition which gives a foam having a high expansion ratio and having uniform closed cells. The expandable resin composition comprises heat-expandable microcapsules and a resin composition, wherein the heat-expandable microcapsules begin to thermally expand at a temperature which is lower than the temperature higher by 10°C than the curing initiation temperature for the resin composition.
Inventors:
YAMAUCHI HIROSHI (JP)
KAWAGUCHI YASUHIRO (JP)
KAWAGUCHI YASUHIRO (JP)
Application Number:
PCT/JP2003/016907
Publication Date:
July 22, 2004
Filing Date:
December 26, 2003
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
YAMAUCHI HIROSHI (JP)
KAWAGUCHI YASUHIRO (JP)
YAMAUCHI HIROSHI (JP)
KAWAGUCHI YASUHIRO (JP)
International Classes:
C08J9/32; (IPC1-7): C08J9/32
Foreign References:
| JPH0632931A | 1994-02-08 | |||
| JP2004002719A | 2004-01-08 | |||
| JPS574742A | 1982-01-11 |
Other References:
See also references of EP 1582558A1
Attorney, Agent or Firm:
Yasutomi, Yasuo (4-20 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka, JP)
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