Title:
EXPOSURE DEVICE AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/040890
Kind Code:
A1
Abstract:
There are provided an exposure device including a measurement stage having various measurement devices arranged so as not to reduce the measurement accuracy and a device manufacturing method using the exposure device. The exposure device has a measurement stage provided independently of a wafer state for holding a wafer. A measurement table (MTB) held on the upper surface of the measurement stage includes a reference plate (53) having a first reference mark (FM1) used by a space image measurement device and a second reference mark (FM2) for measuring the positional relationship of the wafer stage with respect to the reticle pattern projected image. The reference plate (53) and the space image measurement device are arranged in the vicinity of a reflection plane (51X) where the beam from the X-axis interferometer is projected and a reflection plane (50) where the beam from the Y-axis interferometer is projected.
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Inventors:
ARAI DAI (JP)
Application Number:
PCT/JP2005/016379
Publication Date:
April 20, 2006
Filing Date:
September 07, 2005
Export Citation:
Assignee:
NIKON CORP (JP)
ARAI DAI (JP)
ARAI DAI (JP)
International Classes:
H01L21/027; G01B11/00; G03F7/20; H01L21/68
Domestic Patent References:
| WO2004059710A1 | 2004-07-15 | |||
| WO2003087934A2 | 2003-10-23 | |||
| WO1999049504A1 | 1999-09-30 |
Foreign References:
| JP2000164504A | 2000-06-16 | |||
| JP2001160530A | 2001-06-12 | |||
| JPH11135400A | 1999-05-21 |
Other References:
See also references of EP 1806771A4
Attorney, Agent or Firm:
Shiga, Masatake (Yaesu Chuo-ku, Tokyo 53, JP)
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