Title:
EXTRUDED RESIN PLATE AND METHOD FOR MANUFACTURING SAME, AND LAMINATED PLATE
Document Type and Number:
WIPO Patent Application WO/2019/225676
Kind Code:
A1
Abstract:
The present invention provides an extruded resin plate in which the rate of decrease in the Re value due to heating is small, and there is no warping due to heating. In the present invention, a thermoplastic resin layered body in which a methacrylic resin layer is layered on at least one surface of a polycarbonate-containing layer (glass transition temperature: Tg (PC)) is coextruded from a T die in a molten state and cooled using a plurality of cooling rolls. In the expressions below, TX is the overall temperature of the thermoplastic resin layered body when pinched between a second cooling roll and a third cooling roll, TT is the overall temperature of the thermoplastic resin layered body in the position of release thereof from the final cooling roll, TM is the overall temperature of the thermoplastic resin layered body 1 m or less downstream from the position of release thereof from the final cooling roll, V4 is the peripheral speed of a take-off roll, and V2 is the peripheral speed of the second cooling roll. TX (°C) ≥ Tg (PC) + 15, Tg (PC) + 5 ≤ TT (°C) ≤ Tg (PC + 19, TT – TM (°C) ≤ 20, and 0.98 ≤ V4/V2 < 1.0.
Inventors:
FUNAZAKI KAZUO (JP)
Application Number:
PCT/JP2019/020387
Publication Date:
November 28, 2019
Filing Date:
May 23, 2019
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B29C48/885; B29C48/21; B29C48/305; B32B27/30; B32B27/36; G02F1/13; G02F1/1333
Domestic Patent References:
| WO2018030504A1 | 2018-02-15 |
Foreign References:
| JP2005061757A | 2005-03-10 | |||
| JPH0996702A | 1997-04-08 | |||
| JPS557451A | 1980-01-19 | |||
| JP2016534898A | 2016-11-10 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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