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Title:
FABRICATION METHOD FOR PHOTOSENSITIVE ASSEMBLY, AND PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2021/128031
Kind Code:
A1
Abstract:
The present application relates to a fabrication method for a photosensitive assembly, a photosensitive assembly, a camera module and mobile terminal. The method comprises: providing a circuit board, wherein the circuit board is provided with a first electrical connection part; fixedly disposing a photosensitive chip on the circuit board, wherein the surface of the photosensitive chip away from the circuit board is provided with a second electrical connection part corresponding to the first electrical connection part; placing the circuit board on which the photosensitive chip is fixed, so as to increase the opening area between the photosensitive chip and the circuit board in the direction of an injection insulating layer; forming an insulating layer between a side surface of the photosensitive chip and the circuit board, the insulating layer being used to form a conductive structure that electrically connects the first electrical connection part and the second electrical connection part.

Inventors:
LUO KE (CN)
PARK SEONGHYUNG (CN)
SHUAI WENHUA (CN)
Application Number:
PCT/CN2019/128113
Publication Date:
July 01, 2021
Filing Date:
December 25, 2019
Export Citation:
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Assignee:
NANCHANG OFILM OPTICAL ELECTRONIC TECH CO LTD (CN)
International Classes:
H04N5/225
Foreign References:
CN209328888U2019-08-30
CN203503820U2014-03-26
CN108112229A2018-06-01
CN1879206A2006-12-13
CN109746163A2019-05-14
US20090309179A12009-12-17
US20070264745A12007-11-15
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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