Title:
FAN-OUT SYSTEM-IN-PACKAGE STRUCTURE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/051225
Kind Code:
A1
Abstract:
The present disclosure provides a fan-out system-in-package structure and a manufacturing method therefor. The method comprises: providing a support carrier; forming a first rewiring layer, a metal connection column, and a second rewiring layer; forming a conductive bump electrically connected to the first rewiring layer; providing a first functional chip and a component which are respectively electrically connected to the second rewiring layer; providing a packaging wafer; and connecting the conductive bump to the packaging wafer. According to the present invention, the interconnection between upper and lower layers is realized through the metal connection column, the first functional chip and the component are subjected to high-density connection on the second rewiring layer, and a processor, a memory and other functional chips, photoelectric components, optical elements and MEMS elements are integrated in a packaging wafer to realize a substantially complete function in a single packaging body, thereby improving the level of integration of the process structure. In addition, the second functional chip can be connected to the connector on the conductive bump, so as to improve the flexibility and compatibility and improve the performance of the packaging body while realizing high-density sealing connection.
Inventors:
CHEN YENHENG (CN)
LIN CHENGCHUNG (CN)
LIN CHENGCHUNG (CN)
Application Number:
PCT/CN2023/097799
Publication Date:
March 14, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
SJ SEMICONDUCTOR JIANGYIN CORP (CN)
International Classes:
H01L21/56; H01L21/50; H01L23/538
Foreign References:
| CN115148612A | 2022-10-04 | |||
| CN115458417A | 2022-12-09 | |||
| CN111370387A | 2020-07-03 | |||
| CN113192936A | 2021-07-30 | |||
| CN108231743A | 2018-06-29 | |||
| CN105514087A | 2016-04-20 |
Attorney, Agent or Firm:
J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (GENERAL PARTNERSHIP) (CN)
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