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Patent Searching and Data


Title:
FIBERGLASS BOARD, REAR COVER, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR FIBERGLASS BOARD
Document Type and Number:
WIPO Patent Application WO/2024/021699
Kind Code:
A1
Abstract:
Provided in the present application are a fiberglass board, a rear cover, an electronic device, and a preparation method for a fiberglass board, which are used for improving the puncture resistance of a fiberglass board and improving the use reliability of an electronic device. The fiberglass board comprises a plurality of fiberglass layers, and the plurality of fiberglass layers are stacked. Each fiberglass layer comprises a plurality of first fibers and a plurality of second fibers. Each fiberglass layer has a first direction and a second direction. The plurality of first fibers all extend in the first direction of the fiberglass layer and are arranged at intervals in the second direction of the fiberglass layer. The plurality of second fibers all extend in the first direction of the fiberglass layer and are arranged at intervals in the first direction of the fiberglass layer. The spiral stagger angle between at least two fiberglass layers is greater than 0 degrees, but less than 90 degrees, or is greater than 90 degrees, but less than 180 degrees. The spiral stagger angle between the two fiberglass layers is an included angle between the first directions of the two fiberglass layers, or the spiral stagger angle between the two fiberglass layers is an included angle between the second directions of the two fiberglass layers.

Inventors:
SHEN KUI (CN)
TAN DONGSHENG (CN)
LI JIANPING (CN)
Application Number:
PCT/CN2023/089658
Publication Date:
February 01, 2024
Filing Date:
April 21, 2023
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
B32B17/02; B32B5/04; B32B5/08; B32B7/00; B32B17/04; B32B17/12
Foreign References:
CN206465569U2017-09-05
CN108284619A2018-07-17
CN110712403A2020-01-21
US20200139642A12020-05-07
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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