Title:
FILLER FOR THREE-DIMENSIONAL MOUNTING OF SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2015/046334
Kind Code:
A1
Abstract:
Provided is a filler useful for manufacturing a three-dimensional semiconductor integrated element device made to be thin and low profile during a COW process, and a curable composition forming the filler. This filler for three-dimensional mounting of a semiconductor element fills gaps between semiconductor elements adjacent to each other in the horizontal direction when a three-dimensional semiconductor integrated element device is manufactured by stacking and integrating a plurality of semiconductor elements, wherein the filler is characterized in being a member polished and/or ground flat from the front surface of the semiconductor elements once the filler has filled the gaps between the semiconductor elements.
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Inventors:
TANAKA HIROKI (JP)
NAKAGUCHI KATSUHIRO (JP)
NAKAGUCHI KATSUHIRO (JP)
Application Number:
PCT/JP2014/075433
Publication Date:
April 02, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
H01L23/28; C08G59/20; C08G59/68; C08L63/02; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2012133760A1 | 2012-10-04 |
Foreign References:
| JP2012227441A | 2012-11-15 | |||
| JP2012151109A | 2012-08-09 | |||
| JP2013118276A | 2013-06-13 | |||
| JP2013256634A | 2013-12-26 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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