Title:
FILM ADHESION APPARATUS FOR HOUSING ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/068913
Kind Code:
A1
Abstract:
Disclosed is a film adhesion apparatus for housing an electronic apparatus. The film adhesion apparatus according to various embodiments of the present invention, which adheres a film on the surface of a housing plate in an electronic apparatus having an edge portion having a curve, comprises: a jig for mounting and fixing the housing plate; a roller which presses the film with respect to the housing plate; a vertical driving portion which moves the roller from the upper portion to the lower portion of the surface of the housing plate, to which the film is adhered, and presses the roller with respect to the film; and a horizontal driving portion which moves the roller from the surface of the housing plate in the direction toward the edge portion of the housing plate.
Inventors:
KIM JISUNG (KR)
PARK HANKIL (KR)
HONG SEHWAN (KR)
LEE MYEONGGEUN (KR)
JEONG SEONGJIN (KR)
PARK HANKIL (KR)
HONG SEHWAN (KR)
LEE MYEONGGEUN (KR)
JEONG SEONGJIN (KR)
Application Number:
PCT/KR2022/095137
Publication Date:
April 27, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
JM TECH CO LTD (KR)
JM TECH CO LTD (KR)
International Classes:
B29C63/02; B29C63/22; B29C65/00; B29C65/48; B29C65/78; B29L31/34
Foreign References:
| KR20150068014A | 2015-06-19 | |||
| KR20200004951A | 2020-01-15 | |||
| KR101687338B1 | 2016-12-16 | |||
| KR20170035645A | 2017-03-31 | |||
| JP2001042315A | 2001-02-16 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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