Title:
FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2010/073885
Kind Code:
A1
Abstract:
Disclosed is a film adhesive which is easily miscible, highly plastic, and capable of increasing bond strength by having essential ingredients comprising a bisphenol A-type phenoxy resin with a molecular weight of 30,000 or greater, an epoxy resin with a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-denatured epoxy resin, and a latent curing agent, wherein the epoxy equivalent of the glycidyl methacrylate copolymer is preferably 1000 or less.
Inventors:
TOSHIOKA HIDEAKI (JP)
OKUDA YASUHIRO (JP)
OKUDA YASUHIRO (JP)
Application Number:
PCT/JP2009/070289
Publication Date:
July 01, 2010
Filing Date:
December 03, 2009
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
TOSHIOKA HIDEAKI (JP)
OKUDA YASUHIRO (JP)
TOSHIOKA HIDEAKI (JP)
OKUDA YASUHIRO (JP)
International Classes:
C09J7/00; C09J11/04; C09J133/14; C09J163/00; C09J171/10; H01B1/00; H01B1/20; H01B5/16; H01L21/52; H01L21/60
Foreign References:
| JPH10273635A | 1998-10-13 | |||
| JP2001323242A | 2001-11-22 | |||
| JP2005194413A | 2005-07-21 | |||
| JP2002188070A | 2002-07-05 | |||
| JP2007091959A | 2007-04-12 | |||
| JPH10140128A | 1998-05-26 | |||
| JP4110589B2 | 2008-07-02 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
Download PDF: