Title:
FILM ADHESIVE, DICING AND DIE-BONDING TWO-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2022/137551
Kind Code:
A1
Abstract:
Disclosed is a film adhesive. One mode of the film adhesive contains metal particles and has a shear viscosity of 30,000 Pa∙s or less at 110°C. Another mode of the film adhesive contains metal particles and has a loss modulus of 200 kPa or less at 110°C. Another mode of the film adhesive contains metal particles, a heat-curable resin, a curing agent, and an elastomer, wherein the metal particle content is 74.5 mass% or more and the total content of the heat-curable resin and the curing agent is 13.0 mass% or more based on the total quantity of the metal particles, the heat-curable resin, the curing agent, and the elastomer.
Inventors:
HIRAMOTO YUYA (JP)
TANIGUCHI KOHEI (JP)
ITAGAKI KEI (JP)
KURODA TAKAHIRO (JP)
KAMONO MEGUMI (JP)
AKIYAMA YUYA (JP)
TANIGUCHI KOHEI (JP)
ITAGAKI KEI (JP)
KURODA TAKAHIRO (JP)
KAMONO MEGUMI (JP)
AKIYAMA YUYA (JP)
Application Number:
PCT/JP2020/048896
Publication Date:
June 30, 2022
Filing Date:
December 25, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/52; C09J7/20; C09J7/35; H01L21/301
Foreign References:
| JP2016225342A | 2016-12-28 | |||
| JP2012253278A | 2012-12-20 | |||
| JP2010132884A | 2010-06-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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