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Patent Searching and Data


Title:
FILM CAPACITOR AND METHOD FOR PRODUCING FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2024/009644
Kind Code:
A1
Abstract:
A film capacitor according to the present invention is provided with: a wound body of a pair of dielectric films that are stacked in the thickness direction and have a metal vapor-deposited on the surfaces; and a pair of end face electrodes that are formed on both ends of the wound body. With respect to this film capacitor, a void part is formed between the pair of dielectric films; the wound body has such a shape that the length in a first direction is shorter than the length in a second direction that is perpendicular to the first direction in a cross-section along the direction of the plane in which the end face electrodes extend; and the ratio of the thickness of the void part in the height direction of the wound body to the thickness of the dielectric films in the first direction is 0.003 to 0.029.

Inventors:
MORIKAWA TAISHI (JP)
NISHIJIMA DAIYA (JP)
INAKURA TOMOKI (JP)
HAGIYA KENJI (JP)
Application Number:
PCT/JP2023/019730
Publication Date:
January 11, 2024
Filing Date:
May 26, 2023
Export Citation:
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Assignee:
SHIZUKI ELECTRIC CO INC (JP)
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/32
Foreign References:
JP2015103700A2015-06-04
JPH1167580A1999-03-09
JPH04291711A1992-10-15
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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