Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM CUTTING APPARATUS AND METHOD FOR CUTTING CONTAINER COVER FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/163495
Kind Code:
A1
Abstract:
The present invention relates to a film cutting apparatus and a method for cutting a container cover film using same. In particular, according to an embodiment of the present invention, a film cutting apparatus for cutting a cover film adhered to a container including a plurality of chambers which are connected to one another to be separatable, comprises: a base frame; a pressing module which is coupled to the base frame to be movable in the vertical direction, and is descended to press chambers located at both sides of the container downward; a transport module coupled to one or more of the pressing module and the base frame; and a cutting module coupled to the transport module, wherein the cutting module comprises a plurality of cutting means which can cut the cover film adhered to the container, and the transport module moves the cutting module in the longitudinal direction so that the cover film is cut while the pressing module presses the chambers of the container.

Inventors:
LIM HYUN JIN (KR)
CHO DEOG PILL (KR)
HAN YOOJUN (KR)
JEONG WON SEOK (KR)
Application Number:
PCT/KR2023/002508
Publication Date:
August 31, 2023
Filing Date:
February 22, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEEGENE INC (KR)
International Classes:
B65B61/08; B26D1/14; B26D5/02; B26D5/08; B26D7/02
Foreign References:
KR20190138507A2019-12-13
KR20210097495A2021-08-09
KR20190088965A2019-07-29
JP2009078825A2009-04-16
US20180186024A12018-07-05
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
Download PDF: