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Patent Searching and Data


Title:
FILM CUTTING AND POSITIONING PLATE
Document Type and Number:
WIPO Patent Application WO/2023/168804
Kind Code:
A1
Abstract:
A film cutting and positioning plate, which relate to the technical field of digital product accessories. After a release film (22) is removed, a film to be cut is attached and fixed to a positioning and attaching region, and then the film cutting and positioning plate to which the film is attached is placed in a film cutting machine for film cutting; and after a film cutting operation, the film is removed from the film cutting and positioning plate, and the film cutting and positioning plate can be repeatedly used for the next film cutting. The film cutting and positioning plate is used for support, and an existing large-size cutting blade is replaced with the film cutting and positioning plate to achieve paper feeding and pressing functions, thereby greatly saving cutting materials, reducing the cost, and protecting the environment. In addition, a positioning plate hard layer (11) having a suitable thickness is selected, which can be adapted to various types of intelligent film cutting machines, so that paper feeding is smooth and without jamming, and the problems of slipping during paper feeding and irregular cutting of the film cutting machine can be solved.

Inventors:
ZHANG XIAOPING (CN)
WEI FANGMIN (CN)
Application Number:
PCT/CN2022/088352
Publication Date:
September 14, 2023
Filing Date:
April 22, 2022
Export Citation:
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Assignee:
SHENZHEN LIHENGMEI ELECTRONIC TECH CO LTD (CN)
International Classes:
B26D7/01; B26D7/20; B65B33/02
Foreign References:
US20050186010A12005-08-25
CN210656786U2020-06-02
CN208268173U2018-12-21
CN102632674A2012-08-15
CN103273716A2013-09-04
CN214724633U2021-11-16
CN111230934A2020-06-05
CN207198500U2018-04-06
Attorney, Agent or Firm:
SHENZHEN HUATENG INTELLECTUAL PROPERTY AGENT CO., LTD. (CN)
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