Title:
FILM-FORM ADHESIVE, DICING AND DIE-BONDING TWO-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/152837
Kind Code:
A1
Abstract:
Disclosed is a film-form adhesive. The film-form adhesive contains a thermosetting resin component, an elastomer, and an inorganic filler. The total content value for the thermosetting resin component and elastomer is 58 mass% or greater based on the total amounts of the thermosetting resin component, the elastomer, and the inorganic filler. The mass ratio of the thermosetting resin component to the elastomer is 1.3 or greater.
Inventors:
NIWA TAKAAKI (JP)
KURODA TAKAHIRO (JP)
TANIGUCHI KOHEI (JP)
KURODA TAKAHIRO (JP)
TANIGUCHI KOHEI (JP)
Application Number:
PCT/JP2022/005175
Publication Date:
August 17, 2023
Filing Date:
February 09, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/35; C09J11/04; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
| WO2020013250A1 | 2020-01-16 | |||
| WO2020026757A1 | 2020-02-06 |
Foreign References:
| JP2018014501A | 2018-01-25 | |||
| JP2016100532A | 2016-05-30 | |||
| JP2018195746A | 2018-12-06 | |||
| JP2013028717A | 2013-02-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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