Title:
FILM FORMATION DEVICE AND FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/034435
Kind Code:
A1
Abstract:
The present invention increases the usefulness of ECR plasma technology. A film formation device 1 causes ejected first target particles to be deposited by causing ions (ions constituting ECR plasma) to collide with a cylindrical target TA mounted to a cylindrical target mounting section 27 and causes ejected second target particles to be deposited on the surface of a substrate SUB by causing ions (ions constituting plasma of a different density than that of the ECR plasma) to collide with a disc target TA2 mounted to a disc target mounting section 31.
Inventors:
TORII HIRONORI (JP)
Application Number:
PCT/JP2023/027803
Publication Date:
February 15, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
JSW AFTY CORP (JP)
International Classes:
C23C14/34; C23C14/06; C23C14/35; H01L21/203
Foreign References:
| JP2017008370A | 2017-01-12 | |||
| JP2005350706A | 2005-12-22 | |||
| JP2003247065A | 2003-09-05 | |||
| JPH01201471A | 1989-08-14 | |||
| JPH05507963A | 1993-11-11 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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