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Patent Searching and Data


Title:
FILM FORMATION DEVICE AND FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/070473
Kind Code:
A1
Abstract:
A film formation device according to the present invention is provided with: a film formation source which discharges a film formation material toward a substrate through a mask located between the film formation source and a film-forming surface of the substrate; a restricting plate which is arranged between the film formation source and the mask and restricts a region through which the film formation material enters the substrate; and a restricting plate transfer means which transfers the restricting plate relatively to the film formation source in a direction along the film-forming surface.

Inventors:
ICHIHARA MASAHIRO (JP)
Application Number:
PCT/JP2023/031805
Publication Date:
April 04, 2024
Filing Date:
August 31, 2023
Export Citation:
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Assignee:
CANON TOKKI CORP (JP)
International Classes:
C23C14/04; C23C14/24; H05B33/10; H10K50/10
Domestic Patent References:
WO2019187162A12019-10-03
Foreign References:
JP2019189901A2019-10-31
JP2019178370A2019-10-17
JP2006070330A2006-03-16
JP2015034308A2015-02-19
JP2007277645A2007-10-25
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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