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Patent Searching and Data


Title:
FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/122043
Kind Code:
A1
Abstract:
In a film formation device according to an embodiment, a mounting table is disposed rotatably about an axis. A processing chamber that accommodates the mounting table includes a first region and a second region. As the mounting table rotates, a substrate mounting region of the mounting table moves in a circumferential direction with respect to the axis to pass the first region and the second region in order. A first gas supply unit supplies precursor gas to the first region from an injection unit that is disposed in such a manner as to face the mounting table. An exhaust outlet performs ventilation from an exhaust port that is formed in such a manner as to extend along a closed path which surrounds the vicinity of the exhaust outlet. A second gas supply unit supplies purge gas from a jet orifice that is formed in such a manner as to extend along a closed path which surrounds the vicinity of the exhaust port. A plasma generation unit generates plasma from reaction gas in the second region. In the film formation device, an angular range in which the first region extends in the circumferential direction with respect to the axis is wider than an angular range in which the second region extends in the circumferential direction with respect to the axis.

Inventors:
IWASAKI MASAHIDE (JP)
YONEKURA SATOSHI (JP)
IWAO TOSHIHIKO (JP)
Application Number:
PCT/JP2013/053233
Publication Date:
August 22, 2013
Filing Date:
February 12, 2013
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/455
Foreign References:
JP2011222960A2011-11-04
JP2011134996A2011-07-07
JP2005141941A2005-06-02
JP2010239103A2010-10-21
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: