Title:
FILM FORMATION METHOD AND ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/153123
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technique that is advantageous for curbing a reduction in filling speed even in a case where a liquid film thickness of a curable composition is thick. A film formation method includes: an arrangement step in which a curable composition (102) is arranged atop a base material (101); a contact step in which, after the arrangement step, the curable composition (102) is brought into contact with a film formation region of a mold (107); a curing step in which the curable composition (102) is cured after the contact step; and a separation step in which, after the curing step, the curable composition (102) and the mold (107) are separated from each other. In the contact step, a gas that fills a space between the base material (101) and the mold (107) is present. The solubility coefficient of the gas relative to the curable composition (102) is from 0.5 kg/m3・atm to 10 kg/m3・atm. An average liquid film thickness, which is a value obtained by dividing the volume of the curable composition (102) by the surface area of the film formation region, is equal to or greater than 70 nm.
Inventors:
ITO YUTO (JP)
ITO TOSHIKI (JP)
KAWATA ISAO (JP)
ITO TOSHIKI (JP)
KAWATA ISAO (JP)
Application Number:
PCT/JP2023/000600
Publication Date:
August 17, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Foreign References:
| JP2014196284A | 2014-10-16 | |||
| JP2015099899A | 2015-05-28 | |||
| JP2016054232A | 2016-04-14 | |||
| JP2021089987A | 2021-06-10 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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