Title:
FILM FORMATION METHOD AND FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/132163
Kind Code:
A1
Abstract:
This film formation method includes (A) to (C) below. (A) Preparing a substrate having, on the surface thereof, a first region in which a first material is exposed and a second region in which a second material differing from the first material is exposed. (B) Supplying, to the surface of the substrate, vapor of a solution that includes the raw material for a self-assembled monolayer and a solvent in which the raw material is dissolved, and selectively forming a self-assembled monolayer in the first region among the first region and the second region. (C) Using the self-assembled monolayer formed in the first region to form a desired target film in the second region among the first region and the second region.
Inventors:
KAWANO YUMIKO (JP)
AZUMO SHUJI (JP)
IKE SHINICHI (KR)
AZUMO SHUJI (JP)
IKE SHINICHI (KR)
Application Number:
PCT/JP2020/047698
Publication Date:
July 01, 2021
Filing Date:
December 21, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/316; C23C16/02; C23C16/04
Foreign References:
| JP2018512504A | 2018-05-17 | |||
| US20170062210A1 | 2017-03-02 | |||
| JP2007100191A | 2007-04-19 | |||
| JP2015101772A | 2015-06-04 | |||
| JP2018137435A | 2018-08-30 | |||
| JP2013520028A | 2013-05-30 | |||
| JP2019096877A | 2019-06-20 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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