Title:
FILM FORMING APPARATUS, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/090226
Kind Code:
A1
Abstract:
[Problem] To provide a film forming apparatus which is capable of forming a film that has a uniform film thickness, while suppressing contamination of the working environment during the film formation. [Solution] A film forming apparatus 10 which is characterized by comprising: a film formation chamber 2; a first introduction mechanism IM1 that has a plurality of nozzle holes and is configured so as to introduce a gas, which does not contain a film starting material, into the film formation chamber 2 through the plurality of nozzle holes; and a second introduction mechanism IM2 that is configured so as to form a film 20 on a first member ME by introducing a gas 12, which contains a film starting material, into the film formation chamber 2.
Inventors:
OKUYAMA TETSUO (JP)
TOKUDA KAYA (JP)
MATSUO KEISUKE (JP)
TOKUDA KAYA (JP)
MATSUO KEISUKE (JP)
Application Number:
PCT/JP2023/037043
Publication Date:
May 02, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
H01L21/368; C23C16/448; C23C16/455; H01L21/365
Domestic Patent References:
| WO2021186677A1 | 2021-09-23 |
Foreign References:
| JP2014201804A | 2014-10-27 | |||
| JP2017176949A | 2017-10-05 | |||
| US20040101622A1 | 2004-05-27 |
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