Title:
FILM FORMING DEVICE, FILM FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004501
Kind Code:
A1
Abstract:
In an embodiment, this film forming method comprises a first film forming step for forming a first film formed from an organic material on a substrate by using a mask and a second film forming step for forming a second film formed from an inorganic material on the substrate by using the same mask that is used the first film forming step.
Inventors:
HAMANO AKIHIRO (JP)
MATSUMOTO YUKIO (JP)
SUGAWARA YUKI (JP)
MATSUMOTO YUKIO (JP)
SUGAWARA YUKI (JP)
Application Number:
PCT/JP2023/020409
Publication Date:
January 04, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
CANON TOKKI CORP (JP)
International Classes:
H10K71/16; C23C14/04; C23C16/04; H10K50/11; H10K50/805; H10K50/84; H10K71/60; H10K102/20
Foreign References:
| US20180190907A1 | 2018-07-05 | |||
| JP2009199868A | 2009-09-03 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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