Title:
FILM-FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/093351
Kind Code:
A1
Abstract:
The present application relates to the related technical field of MOCVD apparatuses. Disclosed is a film-forming device, which is used for solving the problem of a poor temperature control effect caused by uneven temperature distribution on a top plate. The film-forming device provided in the present application is provided with a reaction cavity, and comprises a base, a cover assembly and a heating device, wherein the base is positioned at the bottom of the reaction cavity and is used for bearing a substrate; the cover assembly is positioned at the top of the reaction cavity and is arranged opposite the base; the heating device is used for heating the base; and the cover assembly comprises a top plate facing the reaction cavity, and a cooling plate assembly arranged adjacent to the top plate, wherein the top plate is provided with a heated surface facing the reaction cavity and a radiating surface facing the cooling plate assembly, and a circulation gap is formed between the radiating surface of the top plate and the cooling plate assembly, with the circulation gap having a plurality of different heights along the center of the top plate toward the edge of same, and the heights being gap distances between the radiating surface and the cooling plate assembly. The present application is used for improving the temperature uniformity of the top plate.
Inventors:
ZHANG JUNJIE (CN)
Application Number:
PCT/CN2022/125287
Publication Date:
June 01, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
WUXI LEADPRO TECH CO LTD (CN)
International Classes:
C23C16/46
Foreign References:
| CN102428216A | 2012-04-25 | |||
| TW202000964A | 2020-01-01 | |||
| CN112969815A | 2021-06-15 | |||
| CN101631901A | 2010-01-20 | |||
| JPH11180796A | 1999-07-06 |
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