Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND PURIFICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/189712
Kind Code:
A1
Abstract:
This film forming material for lithography contains a resin that has the polybenzimidazole structure represented in formula (1). Y and Z are each a simple bond, a divalent linking group containing a chalcogen atom, a divalent linking group derived from a compound selected from aromatic compounds, etc., the R1s are independently a hydrogen atom or a substituent T selected from the group consisting of a specific alkyl group, a halogen atom, a nitro group, an amino group, a cyano group, a carboxylic acid group, a thiol group and a hydroxy group, the aforementioned alkyl group optionally contains an ether bond, a ketone bond, an ester bond or a urethane bond, R2 is a substituent T, m is an integer 0-3, and n is an integer 1-10000.

Inventors:
HORIUCHI JUNYA (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2020/011944
Publication Date:
September 24, 2020
Filing Date:
March 18, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/18; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
WO2018212116A12018-11-22
Foreign References:
JPS61248039A1986-11-05
JPH0627657A1994-02-04
RU2646088C12018-03-01
CN106803598A2017-06-06
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
Download PDF: