Title:
FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND PURIFICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/189712
Kind Code:
A1
Abstract:
This film forming material for lithography contains a resin that has the polybenzimidazole structure represented in formula (1). Y and Z are each a simple bond, a divalent linking group containing a chalcogen atom, a divalent linking group derived from a compound selected from aromatic compounds, etc., the R1s are independently a hydrogen atom or a substituent T selected from the group consisting of a specific alkyl group, a halogen atom, a nitro group, an amino group, a cyano group, a carboxylic acid group, a thiol group and a hydroxy group, the aforementioned alkyl group optionally contains an ether bond, a ketone bond, an ester bond or a urethane bond, R2 is a substituent T, m is an integer 0-3, and n is an integer 1-10000.
Inventors:
HORIUCHI JUNYA (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2020/011944
Publication Date:
September 24, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/18; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
WO2018212116A1 | 2018-11-22 |
Foreign References:
JPS61248039A | 1986-11-05 | |||
JPH0627657A | 1994-02-04 | |||
RU2646088C1 | 2018-03-01 | |||
CN106803598A | 2017-06-06 |
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
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