Title:
FILM FORMING METHOD AND FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/204022
Kind Code:
A1
Abstract:
Provided are a film forming method and film forming device whereby a resin layer having the desired film properties and pattern shape can be stably formed. The film forming method pertaining to an embodiment of the present invention comprises cooling a substrate W to a first temperature or lower in a chamber in which a reduced-pressure atmosphere is maintained, supplying a starting material gas G which includes an energy-ray-curing resin and can be liquefied at the first temperature or below to a surface of the substrate W from a gas supply unit 13, placing a mask member 16 which has a predetermined open pattern and is maintained at a second temperature higher than the first temperature so as to face the surface of the substrate W, and irradiating the surface of the substrate W with energy rays.
Inventors:
KATO YUKO (JP)
YAJIMA TAKAHIRO (JP)
TOOYAMA YOSHIHIRO (JP)
AODAI MAKOTO (JP)
SEI KENSUKE (JP)
TAKAHASHI HIROHISA (JP)
SAITOU KAZUYA (JP)
YAJIMA TAKAHIRO (JP)
TOOYAMA YOSHIHIRO (JP)
AODAI MAKOTO (JP)
SEI KENSUKE (JP)
TAKAHASHI HIROHISA (JP)
SAITOU KAZUYA (JP)
Application Number:
PCT/JP2016/066895
Publication Date:
December 22, 2016
Filing Date:
June 07, 2016
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/24; B05D1/32; B05D3/06; C23C14/04; C23C14/12
Domestic Patent References:
| WO2012053532A1 | 2012-04-26 |
Foreign References:
| JP2003160855A | 2003-06-06 | |||
| JP2005044592A | 2005-02-17 | |||
| JP2012140695A | 2012-07-26 | |||
| JP2002069013A | 2002-03-08 | |||
| JPH07209864A | 1995-08-11 |
Attorney, Agent or Firm:
OMORI, JUNICHI (JP)
Omori Junichi (JP)
Omori Junichi (JP)
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