Title:
FILM FORMING METHOD AND FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/255191
Kind Code:
A1
Abstract:
This film forming method includes (A) to (D) below. (A) Preparing a substrate having, on a surface thereof, a first region where a first film is exposed, and a second region where a second film formed by a material different from the first film is exposed. (B) Forming a step on the surface such that the first region becomes higher than the second region. (C) Supplying a liquid to the surface on which the step is formed. (D) Supplying a process gas, for chemically changing the liquid, to the surface, moving the liquid from the second region to the first region by means of a reaction between the process gas and the liquid, and selectively forming a film on the first region with respect to the second region.
Inventors:
AZUMO SHUJI (JP)
FUJITA SENA (JP)
MITSUNARI TADASHI (JP)
KAWANO YUMIKO (JP)
IKE SHINICHI (KR)
FUJITA SENA (JP)
MITSUNARI TADASHI (JP)
KAWANO YUMIKO (JP)
IKE SHINICHI (KR)
Application Number:
PCT/JP2022/021412
Publication Date:
December 08, 2022
Filing Date:
May 25, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/44; H01L21/205; H01L21/768
Foreign References:
| JP2021019199A | 2021-02-15 | |||
| JP2020147829A | 2020-09-17 | |||
| JP2004047644A | 2004-02-12 | |||
| JP2009204998A | 2009-09-10 | |||
| JP2007335807A | 2007-12-27 | |||
| JP2021179009A | 2021-11-18 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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