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Title:
FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/128983
Kind Code:
A1
Abstract:
A film forming method having a step in which a unit film forming process is repeated until the thickness of a film formed upon a film-forming target reaches a desired film thickness. The unit film forming process includes: a step (A) in which film is formed on the film-forming target, by cold spraying, while heating the film-forming target by using a heater; and a step (B) in which, after film forming, the film-forming target is heat treated.

Inventors:
SAITO MAKOTO (JP)
HIRAMATSU NORIYUKI (JP)
FUKUSHIMA AKIRA (JP)
Application Number:
PCT/JP2013/063896
Publication Date:
August 28, 2014
Filing Date:
May 20, 2013
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C23C24/04
Foreign References:
JP2006161161A2006-06-22
JP2008127676A2008-06-05
JP2009191349A2009-08-27
Attorney, Agent or Firm:
KUDOH Minoru (JP)
Minoru Kudo (JP)
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