Title:
FILM FOR FORMING PROTECTION FILM
Document Type and Number:
WIPO Patent Application WO/2014/148496
Kind Code:
A1
Abstract:
This film for forming a protection film is made by laminating a resin layer (α) including an acrylic polymer (A1) and a curable epoxy component (B1), and a resin layer (β) including a polymer (A2) which is a polymer different from the acrylic polymer (A1), a curable epoxy component (B2), a coloring agent (D2), and a filler (E2), wherein: the monomers constituting the acrylic polymer (A1) do not include any epoxy-group-containing monomers, or include 8 mass% or less of epoxy-group-containing monomers with respect to the total mass of the monomers; the glass transition temperature of the acrylic polymer (A1) is -3°C or higher; and the gloss value of the surface of the cured resin layer (β) as measured in accordance with JIS Z 8741 is 20 or greater.
Inventors:
YAMAMOTO DAISUKE (JP)
TAKANO KEN (JP)
TAKANO KEN (JP)
Application Number:
PCT/JP2014/057355
Publication Date:
September 25, 2014
Filing Date:
March 18, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L23/29; B32B27/30; C08J5/18; C08L33/00; C08L63/00; C23C26/00; H01L23/31
Foreign References:
| JP2004214288A | 2004-07-29 | |||
| JP2007250970A | 2007-09-27 | |||
| JP2009130233A | 2009-06-11 | |||
| JP2006321216A | 2006-11-30 | |||
| JP2011151361A | 2011-08-04 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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