Title:
FILM AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/113964
Kind Code:
A1
Abstract:
Provided are a film that, when bonded to metal wiring, can suppress distortion of the metal wiring, and a laminate employing the film. The film has a dielectric dissipation factor no greater than 0.005, and a modulus of elasticity at 160°C on at least one surface which is smaller than an internal modulus of elasticity at 160°C.
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Inventors:
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2021/042880
Publication Date:
June 02, 2022
Filing Date:
November 24, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/025; B32B15/08; B32B15/09; B32B15/20; B32B27/36; C08G63/06; C08J5/18; H05K1/03
Domestic Patent References:
| WO2017175649A1 | 2017-10-12 | |||
| WO2021251262A1 | 2021-12-16 |
Foreign References:
| JP2018186303A | 2018-11-22 | |||
| JPH11198285A | 1999-07-27 | |||
| JP2014237769A | 2014-12-18 | |||
| JP2005539382A | 2005-12-22 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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