Title:
FILM-LAMINATED METAL SHEET, METHOD FOR MANUFACTURING SAME, SUBSTRATE FOR FLEXIBLE ELECTRONICS, AND ORGANIC EL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/202771
Kind Code:
A1
Abstract:
The present invention provides a film-laminated metal sheet, a method for manufacturing the same, a substrate for flexible electronics, and an organic EL substrate that not only have satisfactory smoothness, heat-resistance, flexibility, and gas barrier properties but also have exceptional producibility and impose little burden on the environment. Provided is a film-laminated metal sheet in which at least one surface is coated with a resin film, the film-laminated metal sheet being such that the arithmetic mean roughness Sa of the resin film surface is 0.030 μm or less, the maximum peak height Sp of the resin film surface is 0.30 μm or less, and the maximum valley depth Sv of the resin film surface is 1.0 μm or less.
Inventors:
FUJIMOTO SOICHI (JP)
OSHIMA YASUHIDE (JP)
OSHIMA YASUHIDE (JP)
Application Number:
PCT/JP2022/013028
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
B32B15/08; B32B15/09; H05B33/02
Domestic Patent References:
| WO2020137783A1 | 2020-07-02 | |||
| WO2016001971A1 | 2016-01-07 |
Foreign References:
| JP2006160999A | 2006-06-22 | |||
| JP2015195315A | 2015-11-05 | |||
| JP2014208479A | 2014-11-06 | |||
| JP2015195315A | 2015-11-05 |
Attorney, Agent or Firm:
KUMASAKA Akira et al. (JP)
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