Title:
FILM, LAYERED BODY, CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND METHOD FOR PRODUCING LAYERED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/233877
Kind Code:
A1
Abstract:
Provided is a film comprising a layer A and a layer B disposed on at least one surface of layer A. The ratio of the elastic modulus EB at 160°C of layer B to the elastic modulus EA at 160°C of layer A is 1.0 × 10-6 or greater and the dielectric loss tangent is 0.005 or less. Also provided are uses for the film.
Inventors:
YAMADA AKIRA (JP)
KIDO TAKEO (JP)
KIDO TAKEO (JP)
Application Number:
PCT/JP2023/016329
Publication Date:
December 07, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/022; H05K1/03
Foreign References:
| JP2020096094A | 2020-06-18 | |||
| JP2021161185A | 2021-10-11 | |||
| JP2022184736A | 2022-12-13 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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