Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM-LIKE ADHESIVE, LAMINATE SHEET, COMPOSITE SHEET, AND MANUFACTURING METHOD FOR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/137944
Kind Code:
A1
Abstract:
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. When phosphorus concentration V1 is measured by performing X-ray photoelectron spectroscopy analysis on one surface of the film-like adhesive before the film-like adhesive is heated at 260°C, and when phosphorus concentration V2 is measured by performing X-ray photoelectron spectroscopy analysis on the surface where V1 was measured on the film-like adhesive after V1 is measured and the film-like adhesive is heated for 10 minutes at 260°C, V1 is 0.1 atomic% or greater, and the rate of decrease in concentration of phosphorus calculated from V1 and V2 is 25% or less.

More Like This:
WO/2022/118499ADHESIVE SHEET
JP7166056Method for producing hard coat film
JP5663928Manufacturing method of decorative sheet, decorative sheet and decorative resin molded product using it
Inventors:
SATO YOSUKE (JP)
Application Number:
PCT/JP2019/050292
Publication Date:
July 02, 2020
Filing Date:
December 23, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/18; B32B27/30; B32B27/38; C09J7/30; C09J7/38; C09J11/06; C09J11/08; C09J133/00; C09J161/06; C09J163/00; C09J201/00; H01L21/52
Domestic Patent References:
WO2014109212A12014-07-17
Foreign References:
JP2008063551A2008-03-21
JP2015198120A2015-11-09
JP2003277481A2003-10-02
JP2004083834A2004-03-18
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: BAND CLAMP

Next Patent: RESIN COMPOSITION, FIBER-REINFORCED PLASTIC MOLDING MATERIAL, AND MOLDED ARTICLE