Title:
FILM-LIKE ADHESIVE AND MANUFACTURING METHOD THEREFOR, DICING/DIE ATTACH FILM, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/138455
Kind Code:
A1
Abstract:
Disclosed is a film-like adhesive. The film-like adhesive contains metal particles, a thermosetting resin, a setting agent, and an elastomer. The average diameter (D50) of the metal particles is 1.0-2.5 μm. A manufacturing method for the film-like adhesive is also disclosed. The manufacturing method for the film-like adhesive comprises a step for preparing an adhesive varnish by mixing a starting material varnish containing metal particles, a thermosetting resin, a setting agent, an elastomer, and an organic solvent at a mixing temperature of 50°C or higher, and a step for using the adhesive varnish to form a film-like adhesive.
Inventors:
MORIYA KENYA (JP)
KURODA TAKAHIRO (JP)
TANIGUCHI KOHEI (JP)
KURODA TAKAHIRO (JP)
TANIGUCHI KOHEI (JP)
Application Number:
PCT/JP2021/046576
Publication Date:
June 30, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/52; C09J7/20; C09J7/35; H01L21/301
Domestic Patent References:
| WO2008065728A1 | 2008-06-05 |
Foreign References:
| JP2014216611A | 2014-11-17 | |||
| JP2016103524A | 2016-06-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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